[Patent Name] Cover tape for electronic components [Applicant] Dainippon Printing Co., Ltd. [Inventor] Fujii Kazuhito; Kato Shinichi [Address of Principal Applicant] Tokyo, Japan [Application Number] 200480010930.X
ã€ Application Date ã€‘ 2004.04.26
ã€Approval Announcement No.ã€‘ 1777547
ã€ Validation announcement date ã€‘ 2006.05.24
[Main classification number] B65D65/40(2006.01)I
[Category Code] B65D65/40(2006.01)I B65D73/02(2006.01)I B32B27/32(2006.01)I
[Priority] 2003.4.24 JP 119929/2003
[Summary] 1. A cover tape for packaging of electronic components, which is a tape cover tape for heat-sealing an electronic component containing a carrier tape of an electronic component, and has a base film layer and a soft material layer. And a thermal adhesive layer, wherein the soft material layer is composed of metallocene linear low-density polyethylene, and the metallocene linear low-density polyethylene has a specific gravity of 0.888 to 0.907.
[Instruction CD-ROM] D0621-1
ã€International Applicationã€‘ 2004-04-26 PCT/JP2004/005981
ã€International Publicationã€‘ 2004-11-04 WO2004/094258 [Abstract] The present invention relates to a cover tape for packaging an electronic component tape for heat-sealing a carrier tape containing electronic components. The cover tape for packaging an electronic component tape according to the present invention includes a base material film layer, a soft material layer, and a thermal adhesive layer. The soft material layer is composed of metallocene linear low-density polyethylene, and the metallocene linear low-density polyethylene has a specific gravity of 0.888 to 0.907.
ã€ Agency ã€‘ China Patent Agent (Hong Kong) Co., Ltd. [Proxy] Guo Yan Zou Xuemei
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